According to their announcement:
"… TSV interposers with embedded capacitors provide the shortest electrical path between devices and power supply decoupling capacitors. TSVs with their very low inductance interconnects thus will enable very high electrical performance when integrated with embedded thin film capacitors.
ALLVIA's silicon TSV interposers enable interconnect pitch matching between a high-density IC chip and an organic or a ceramic substrate. Further, they provide a very low stress interconnect to Si ICs that use low-k dielectrics. These benefits make ALLVIA's interposers an attractive solution for advanced packaging of next generation logic devices."
EETimes covered the story here.
One more innovation that moves vertical integration nearer to the main stream…